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Next Generation Automotive Development Platform - Thundercomm - IoT ecosystem - 45IOT

Next Generation Automotive Development Platform

To help automakers bring highly differentiated and customizable in-car experiences to all tiers, the Qualcomm® Snapdragon™ automotive development platform (ADP) based on the Qualcomm® Snapdragon™ Next generation processor features integrated heterogeneous computing, high-performance artificial intelligence (AI) capabilities, and scalability with a unified software framework. It supports higher levels of computing and intelligence needed for advanced capabilities featured in next generation vehicles, including highly intuitive AI experiences for in-car virtual assistance, natural interactions between the vehicle and driver, contextual safety use cases, immersive graphics, multimedia, computer vision, premium audio, advanced wireless technologies, extraordinary camera capabilities, entertainment, and more.
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To help automakers bring highly differentiated and customizable in-car experiences to all tiers, the Qualcomm® Snapdragon™ automotive development platform (ADP) based on the Qualcomm® Snapdragon™ Next generation processor features integrated heterogeneous computing, high-performance artificial intelligence (AI) capabilities, and scalability with a unified software framework. It supports higher levels of computing and intelligence needed for advanced capabilities featured in next generation vehicles, including highly intuitive AI experiences for in-car virtual assistance, natural interactions between the vehicle and driver, contextual safety use cases, immersive graphics, multimedia, computer vision, premium audio, advanced wireless technologies, extraordinary camera capabilities, entertainment, and more.

 

The Next generation Snapdragon™ processor is armed with the best of the proven heterogeneous compute technologies, including the multi-core Qualcomm AI Engine, Qualcomm Spectra Image Signal Processor (ISP), fourth-generation Qualcomm Kryo Central Processing Unit (CPU), Qualcomm Hexagon Processor, sixth-generation Qualcomm Adreno Visual Subsystem, and more. Essentially, these technologies inside the platform are designed to deliver immersive graphics, multimedia, computer vision and artificial intelligence capabilities. The new platform also offer comprehensive software support for Android, LINUX, QNX, Greenhills, and other high-level and real-time operating systems individually or in multiple combinations enabled by industry-leading virtualization SW architecture — providing flexible and scalable software solutions to support engine control unit (ECU) consolidation, and diverse multi-display app rich ecosystems and novel and intuitive experiences.

 

The Snapdragon Next generation processor offers many advantages:

 

High performance computing with AI is enabling new intuitive vehicle experiences

 
  • New AI personalized experiences- using artificial intelligence and computer vision
  • Contextual safety – more computer vision, camera and AI workloads
  • Stunning visual & audio - more displays & speakers, and multi-mode machine interfaces using AI
 

Heterogeneous SoC architecture with virtualization is addressing vehicle domain consolidation

 
  • Convergence - instrument cluster, infotainment, intelligent cameras & driver monitoring
  • Multi-OS architecture – Linux, QNX, Android, Integrity
  • High concurrency- Advanced Concurrent Operations
  • High performance/concurrency-Partitioning algorithms across heterogeneous engines for more work to be done per clock cycle
  • Power efficiency-Matching each algorithm to appropriate processing engine to do more at lower power
  • Lower cost-Integrated solution, reducing the number of components and minimizing the need for wiring and cooling systems
  • Real-time support-Hypervisor support and customized engines to meet latency-critical requirements
 

Scalability with unified software framework is delivering rich in-vehicle experiences to all tiers

 
  • Scalable, module architecture – Addressing all tiers
  • Unified software framework – with highly differentiated features
 

CPU


+ Custom 64-bit Kryo octa-core CPU

+ 7nm process for faster peak performance

 

GPU


+ Adreno 640 GPU

+ 1.1 TFLOPS OpenGL ES 3.1, Vulcan Qualcomm® FlexRenderTM Technology, Binning Architecture, HW Virtualization, Context Separation

 

DSP


+ Qualcomm® Hexagon™ 696 DSP with Hexagon Vector eXtensions

+ Large SIMD extensions with 1024 bit SIMD * 4 vector slot VLIW

+ Power optimized solution for Vision and neural processing based ADAS features

 

Display


+ Qualcomm Spectra™ ISP 380 for image recognition, and face detection

+ Up to 4K resolution supporting multiple touchscreen displays

+ 2x via dual MIPI 4-Lane DSI to DP

+ 2x via USB to DP

+ 1x eDP

 

Memory & Storage


+ 4 × 16 LPDDR4X with ECC

+ 1x UFS3.0 gear4 2 Lane

 

Modem


+ Leading 2Gbps LTE w 10x CA

+ Integrated Qualcomm® Mobile Platform X24 LTE modem with Cat20

 

Cameras and sensors


+ Support for up to 8 simultaneous camera sensor inputs

 

Location


+ Integrated Gen9 VT B

+ Qualcomm® Location Suite with support for GPS, GLONASS, BeiDou, Galileo, and QZSS systems

 

Security


+ Qualcomm® SecureMSM™ foundation

+ Qualcomm® Snapdragon™ Smart Protect

+ TrustZone, DRM, Deep learning based

 

Connectivity


+ Fully integrated chipset solution with QCA6574 supporting 2-stream 11ac Wi-Fi

+ BT LE 5.1

 

Multimedia


+ Next generation audio and video codecs in hardware including HEVC, VP9 DVR capability with H.265 encode

+ 4K Encode and Decode

+ Multiple 4K displays, up to 3 simultaneous displays

 

Specifications and features are subject to change without notice. Qualcomm Adreno, Qualcomm AI Engine, Qualcomm Hexagon, Qualcomm Kryo, Qualcomm Snapdragon, and Qualcomm Spectra are products of Qualcomm Technologies, Inc. and/or its subsidiaries.



Feature

Description

Detail

Size

7.5cm x 7.0cm x 2.0cm

Length width height

Power

+6 V to +20 V

+12 VDC Typical

Protection: Over / Under Voltage, Over Current, Reverse Polarity, Load Dump

SoC

Next generation SoC

23 mm × 23 mm × 2.42 mm FCBGA989 package

PMIC

2xPMMXXXX AU

-

Memory

LPDDR4X:2x4GByte

Soldered down on SoC Card JEDEC STD Footprint.

Storage

UFS: 128 GBytes

SD: uSD Connector

SIM: Dual SIM Socket for UIM

SIM: Dual SIM Socket for UIM

USB

1x USB2.0, 1x USB3.1

All USB interfaces brought out to USB Type A connectors

PCIe

1x PCIe Gen3 x1 lane,

1x PCIe Gen3 x2 lane,

All PCIe lanes pinned out to a custom board-to-board connector. One PCIe Gen3 x 1 lane routed to Wi-Fi module.

Video output

2x DSI x 4 lane, 1x DP

All DSI ports have bridge-chip to DP

Video input

4x CSI x 4 lane

Supports 8 cameras via dual GMSL to CSI Deserializer

Audio

6x Class D Amplifier Analog OUT

4x MIC IN

3x LINE IN

2x A2B

NXP Mercury

Broadcast radio tuner

AM / FM

NXP Mercury

Wired networking

1x Gigabit Ethernet w/EAVB

RGMII w/ PHY

Wireless networking

Wi-Fi and BT

QCA6574 or QCA6595 or QCA6696

Cellular and GPS

SDR8150 (not autograde)

Sensors

 

Sensors

 

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