The Qualcomm Robotics RB3 development kit includes the purpose-built robotics-focused DragonBoard™ 845c development board, based on the Qualcomm® SDA845 processor and compliant with the 96Boards open hardware specification to support a broad range of mezzanine-board expansions.
The Qualcomm SDA845 processor is a heterogeneous computing architecture and integrates an Octa Core Qualcomm® Kryo™ CPU with performance up to 2.8GHz a Qualcomm® Adreno™ 630 Visual Processing Subsystem (including GPU, VPU and DPU), and a Qualcomm® Hexagon™ 685 DSP with Hexagon Vector Extensions (HVX) delivering sophisticated, on-device AI processing and mobile-optimized computer vision (CV) capabilities for perception, navigation and manipulation.
The development board supports Linux and Robotics Operating System (ROS), while also including support for the Qualcomm® Neural Processing software development kit (SDK) for advanced on-device AI, the Qualcomm® Computer Vision Suite, the Qualcomm® Hexagon DSP SDK, and AWS RoboMaker.
The kit includes:
|On-device intelligence powered by Artificial Intelligence Engine (AIE)||Power efficient and cost-effective|
|The Qualcomm® AI Engine on the Qualcomm® Robotics RB3 Platform includes the Qualcomm® Neural Processing SDK, which encompasses analysis, optimization, and debugging tools designed to allow developers and manufacturers to port trained deep learning networks on the various heterogeneous compute blocks offered by the platform.||The Qualcomm® Robotics RB3 Platform is designed to support large industrial and enterpriseenterprise robot’s as well as small battery-operated robots with challenging power and thermal dissipation requirements.|
|Comprehensive development kit||Flexible design options for commercialization|
|Further reduce development time and complexity for intelligent high-performance robots using a feature packed development kit. The kit includes the robotics-focused DragonBoard™ 845c development board, compliant with the 96Boards open hardware specification for supporting a broad range of mezzanine-board expansions and range of sensor support like time-of-flight (ToF), active stereo camera, multi-mic, IMU and proximity.||In addition to a feature packed development kit, the platform offers a range of solutions for commercialization from off-the-shelf System-on-Module (SoM) solutions to speed commercialization, to the flexibility for chip-on-board designs for cost-optimization at scale.|
|High resolution depth sensing||Time-of-Flight (ToF) camera|
|Powered by Qualcomm Spectra™ 280 ISP for high resolution and high accuracy depth sensing||Time-of-flight for gestures and hand tracking use cases|
|Tracking camera||Advanced security|
|Sensor module to do visual Simultaneous Localization and Mapping (vSLAM)||Qualcomm ®Secure Processing Unit, hardware root of trust, trusted execution environment, secure boot, camera security|
|Support for multiple sensors and 3rd party algorithms through Sensor Software Framework||Wi-Fi integrated 802.11ac 2x2 with MU-MIMO and support for Bluetooth 5.0 and cellular mezzanines for LTE and CBRS|
Qualcomm’s Robotics RB3 Platform with ROS has been seamlessly integrated with and drives Kobuki mobile research base. RB3 platform’s ToF camera or structured light camera can be used for depth mapping and development of navigation algorithms to drive the Kobuki. RB3 platform’s tracking camera can be used for visual simultaneous location and mapping (vSLAM), and the high resolution camera can be used for video recording.
|Component||Qualcomm® Robotics RB3 Development Kit|
|CPU||SDA845 8x Kryo 385 CPU, up to 2.8 GHz|
|GPU||Qualcomm® Adreno™ 630 GPU with support for Open GL ES 3.2 and Open CL 2.0|
|DSP||Qualcomm® Hexagon™ 685 DSP with 3rd Gen Vector Extensions|
|ISP||Qualcomm® Spectra™ 280 Image Signal Processor with new architecture for 14-bit image signal processing|
|RAM||4GB LPDDR4x SDRAM @ 1866 MHz|
|Memory||LPDDR4x, 4x16 bit; up to 1866MHz, 4GB RAM|
|Storage||64GB UFS 2.1 on-board storage and 1 x MicroSD card slot|
|Ethernet||1x GbE Ethernet|
|Wireless||Wi-Fi integrated 802.11ac 2x2 with MU-MIMO; Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual Band Simultaneous (DBS).
Qualcomm® TrueWireless™ Bluetooth 5.0
|Location||GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS|
|USB||1 x USB 2.0 Micro B (Debug only)
1 x USB 3.0 Type C (OTG mode)
2x USB 3.0 Type A (Host mode only)
|Display||Two 4-lane DSI, D-PHY 1.2 or C-PHY 1.0; VESA DSC 1.1
1 x HDMI 1.4 (Type A - full) connector
|Video||Ultra HD Premium video capture @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut; H.264 (AVC), H.265 (HEVC) and VP9 support; Slow motion HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) up to 240fps|
|Audio||MP3; aacPlus, eAAC; WMA 9/Pro|
|Camera||Single HFR 16 MPix camera at 60fps ZSL, Dual 16 MPix cameras at 30fps ZSL, Single 32 MPix camera at 30fps ZSL|
|Sensor||Accelerometer + Gyro Sensor/ Proximity sensor|
|Expansion Interfaces||2 x 60 pin High-Speed connectors , 2 x 40 pin Low-Speed connectors, 1 x 20 pin Low-Speed connector|
|LED||7 x LED indicators|
|Button||Power ,Volume Up/Down,Force Usb Boot, DIP Switch|
|Power Source||12V@2.5A adapter with a DC plug|
|Size||85mm by 54 mm|
|Documentation||Hardware||Quick Start Guide|
|Robotics DragonBoard 845c Spec|
|Robotics Navigation Mezzanine Spec|
|Robotics Machine Communication Mezzanine Spec|
|Main Camera Spec|
|Tracking Camera Spec|
|ToF Camera Hardware User Guide|
|SLM Camera Hardware User Guide|
|Qualcomm Robotics RB3 Platform Hardware User Guide|
|Qualcomm Robotics RB3 Platform Schematics.pdf|
|Qualcomm Robotics RB3 Platform 3D STEP Models|
|D845 SOM Datasheet|
|D845 SOM GPIO Pin Assignment|
|Software||Qualcomm Robotics RB3 Platform Linux User Guide|
|Qualcomm Robotics RB3 Platform Release notes|
|SLM Camera ImageViewer.pdf|
|Firmware||Qualcomm Robotics RB3 Platform Image|
|Tools||SLM Camera Image Viewer.exe|
|App Toolchain SDK|
|QTI USB driver|
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ToF Camera module using Panasonic's ToF sensor (P/N: MN34906) for Qualcomm Robotics RB3 Platform using SDA845. This camera has VGA Resolution, 90 degree x 70 degree FOV and uses a single 850 nm VCSEL. The camera provides 0.2m to 4.5m working distance and outputs depth map as well as NIR image for the same frame.
SLM Camera Altek 3D sensing module KaraA2 is an active camera module with high quality depth map output by MIPI interface. KaraA2 features stereo IR image sensors and an RGB color sensor. KaraA2 with Altek 3D depth processor AL6100 handles stereo camera to generate realtime high quality depth data and is compatible with the SDK for Linux based devices. With compact design, KaraA2 can be integrated into system design quickly and easily. KaraA2 is suitable for short and long range depth sensing product applications.
Machine Communication Mezzanine is designed to connect the cellular networks, adopts Sierra Wireless EM7565 Module which offers global 4G coverage, CBRS for private LTE networks, unprecedented LTE speeds, bandwidth, and network performance on the M.2 form factor.A built in Global Positioning System (GPS) device adds location and navigation to your application.