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Thundercomm TurboX™ D845 SOM - Thundercomm - IoT ecosystem - 45IOT

Thundercomm TurboX™ D845 SOM

Thundercomm TurboX™ D845 SOM is a small size (60mm x 37mm) with a board to board connecter, production ready and pre-certified system on module powered by the top-tier Qualcomm® Snapdragon™ 845 processor. This processor introduces new Qualcomm Hexagon 685 Vector DSP architecture, plus GPU and CPU optimizations, that together deliver up to three times faster processing of neural networks running on-device compared to the prior generation SoC. Thundercomm TurboX™ D845 SOM supports new architectures for AI, premium 4K@60fps in HDR ,new security layers and immersive XR experiences. It offers both Andriod and Linux OS for developers to choose. This will be an ideal platform for high computing power required embedded IoT products.
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Major Target Markets

HW Block Diagram

S845 SOM General SPEC

   Category    Item    Description
     Platform    Chipset    Qualcomm® Snapdragon™ 845 processor
   CPU    64-bit applications processor (Kryo 385) with 2 MB L3 cache;
   Quad high-performance Kryo cores 2.649 GHz - Kryo Gold cluster with 256 kB L2 cache per core,
   Kryo Gold single- core boost at 2.803 GHz;
   Quad low - power Kryo cores at 1.766 GHz - Kryo Silver cluster with 128 kB L2 cache per core
   GPU    Qualcomm® Adreno™630 graphics processing unit(GPU) 4K 60 fps or 2 ⅹ2k 90 fps
   OpenGL ES 3.2 + AEP , DX next, Vulkan 2
   OpenCL 2.0 full profile, RenderScript
   DSP    Compute DSP with Qualcomm®Hexaron™Vector
   Extensions (HVX) processor
   OS    Android 8 / Linux
   Memory and Storage    LPDDR4x 4GB + UFS 64GB
  Multimedia    Display    2x MIPI-DSI 4-lane, Up to 3840*2400@60fps
   Camera    Qualcomm® Spectra™ 280 ISP: Support 3 x 4-lane MIPI_CSI + 1 x 2-lane MIPI_CSI, Dual 14-bit ISP + one Lite ISP, up to 32MP
   Decode    4K60 decode for H.264 High Profile, H.265 Main 10 PROFILE and VP9 Profile 2
   Encode    4K60 encode for H.264 High Profile,
   H.265 Main 10 Profile ; 4K30 encode for VP8
 Connectivity    WIFI/BT    802.11a/b/g/a/n/ac 2ⅹ2 MIMO&BT 5.0 with BLE
   Interface    Interface    USB3.1 x 2;  PCIe2.1 x 1; PCIe3.0 x 1; SDIO 3.0ⅹ1;
   TF card x 1; QUP for UART/I2C/SPI x 5, GPIO x8, MI2S x4;
  Dimension    Size    60mm x 37mm x 6.4mm
  System
 Environment
   Power    +3.8V/3A Input
   Operating Temp    -20 ~ 55°C
   Storage Temp    -40°C ~ 70°C
   Relative Humidity    5 to 95% non-condensing

Other

             
  Carrier Board For TurboX 845    1x 3.5mm ANC headset
   Audio codec on board
   Power    DC-IN +12V
   Other Interfaces    1 x UART debug
   1 x USB 3.0 host Type A
   2 x USB 2.0 host, PCIE to USB
   1 x USB 3.0 Type C
   2 x HDMI OUT
   1 xCAN
   2 xLAN
                                                                                                   

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#D845  #SOM  #Hexagon-685  #MEDICAL  #SMART-CITY  #ROBOT  #SIGNAGE  #VR/AR  #AI 
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